Ga-doped ZnO (GZO) films were deposited by an RF magnetron sputtering method on glass substrates using ZnO as a target containing 5 wt% Ga₂O₃ powder (for Ga doping). The structural, electrical, and optical properties of the GZO thin films were investigated as a function of the substrate temperatures. The deposition rate decreased with increasing substrate temperatures from room temperature to 350℃. The films showed typical orientation with the c-axis vertical to the glass substrates and the grain size increased up to a substrate temperature of 300℃ but decreased beyond 350℃. The resistivity of GZO thin films deposited at the substrate temperature of 300℃ was 7×10^-4 Ωcm, and it showed a dependence on the carrier concentration and mobility. The optical transmittances of the films with thickness of 3,000 Å were above 80% in the visible region, regardless of the substrate temperatures.

(Ga203)x(ZnO)100-x, (GZO) films were prepared at room temperature by using a facing target sputtering (FTS) system and their electrical resistivites was investigated as a function of the Ga203 content. The GZO film with an atomic ratio of Ga203 of x 7 wt. %, shows the lowest resistivity of 7.5 X 10-4 cm. The GZO films were also prepared at various substrate temperatures from room temperature to 300t, and their electrical resistivity was found to be improved as the substrate temperature was increased, A very low resistivity of 2.8x 10u1 n that is almost comparable with that of ITO film was obtained in the GZO films prepared at the substrate temperature of 300t by using the FTS.

Thermoelectric bismuth telluride (Bi2Te3) films were deposited on 4° off oriented (001) GaAs substrates using a modified metal organic chemical vapor deposition (MOCVD) system. The effects of substrate temperature on surface morphologies, crystallinity, electrical properties and thermoelctric properties were investigated. Two dimensional growth mode (2D) was observed at substrate temperature lower than 400℃. However, three dimensional growth mode (3D) was observed at substrate temperature higher than 400℃. Change of growth mechanism from 2D to 3D was confirmed with environmental scanning electron microscope (E-SEM) and X-ray diffraction analysis. Seebeck coefficients of all samples have negative values. This result indicates that Bi2Te3 films grown by modified MOCVD are n-type. The maximum value of Seebeck coefficient was -225 μV/K and the power factor was 1.86×10-3 W/mK2 at the substrate temperature of 400℃. Bi2Te3 films deposited using modified MOCVD can be used to fabricate high-performance thermoelectric devices.

In this paper, CuInSe2 thin film was prepared by use of the co-evaporation method with the variation of the substrate temperature in the range of 100℃ to 400℃. The film was annealed at 300℃ for an hour in a vacuum chamber at 3×10-4 Pa. After annealing, the thin film prepared at the substrate temperatures of 100℃ and 200℃ was observed. The XRD (x-ray diffraction) pattern of sample prepared at 100℃ showed the single phase formation of CuInSe2. However, at 200℃, there was no apparent difference in the XRD pattern except a variation in the intensity of the peak. As the annealing treatment of substrate improved the crystal structure of the film, it affected to the increase of an electron mobility, resulted in an increase in conductivity and a decrease in resistance. As a results, when the substrate temperature was at 200℃ and 300℃, the sheet resistance was 1.534 n/and 1.554 n/, respectively, and the resistivity was 1.76×10-6 n·㎝ and 1.7210-6 n·㎝, respectively. From the absorption spectrum measurements, there was no variation between the before and after annealing conductions. And it means that the annealing step does not affect the thickness of the thin film.