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Solderability
WHERE t1.sid in(parameter_dbtbl_keyword '%Solderability%') and t1.xml_status <> 99
2
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"Solderability"
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Solderability (2)
Ceramic insulator (1)
IMC (1)
Intermetilic compound (1)
Lead-free Solder (1)
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Publication year
2003 (2)
Authors
Ug Bang (1)
Sung Jin Hwang (1)
Nam Gyun Kim (1)
Eun Dong Kim (1)
Hui Hong Lee (1)
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Keywords
Solderability (2)
Ceramic insulator (1)
IMC (1)
Intermetilic compound (1)
Lead-free Solder (1)
Peel test (1)
Power module (1)
Solder interface (1)
Wetting balance test (1)
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authors
Ug Bang (1)
Sung Jin Hwang (1)
Nam Gyun Kim (1)
Eun Dong Kim (1)
Hui Hong Lee (1)
Gil Su Seo (1)
Young Eui Shin (1)
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2003 (2)
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"Solderability"
Other : Characterization of the Soldering Interface in Power Modules by Peel Strength Measurement
Nam Gyun Kim, Hui Hong Lee, Ug Bang, Gil Su Seo, Eun Dong Kim
J Korean Inst Electr Electron Mater Eng
2003;16(12):1142-1149.
Published online December 1, 2003
DOI:
https://doi.org/10.4313/JKEM.2003.16.12.1142
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Other : Characterization of the Sn-Ag-Cu and Sn-Cu Lead-free Solder by adding P
Young Eui Shin, Sung Jin Hwang
J Korean Inst Electr Electron Mater Eng
2003;16(6):549-554.
Published online June 1, 2003
DOI:
https://doi.org/10.4313/JKEM.2003.16.6.549
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