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"Solder joint reliability"

Nano Materials and Devices : A Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer
An Seob Shin, Dae Yool Ok, Gi Ho Jeong, Min Ju Kim, Chang Sik Park, Jin Ho Kong, Cheol Ho Heo
J Electr Electron Mater 2010;23(6):481-486.   Published online June 1, 2010
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