In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen`s bonding area below 3.5mm2, and were from 17 to 21% at specimen`s bonding area above 12 mm2. On the other hand, Specimen`s mean deviation rates were about 5% at specimen`s bonding area more than 12 mm2. Inversely, at specimen`s bonding area is less then 3.5 mm2, mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength.

This paper presents the design and reliability evaluation of metallized film capacitor for power electronics application. The rated voltage of development capacitor is DC 3300[V], the capacitance is 5 μF and the ripple current capability is 130 A(rms). Film metallization and patterns are an important design factor that has been development enhance the electric and reliability properties of film capacitor for power electro nics. In term of capacitor construction and metallized pattern is one of the parameters that can be modified to further improve the rating in the terms of maximum ripple current and lifetime. This capacitor can be used as snubber capacitor application such as power train invertor system.