Citations

Citations to this article as recorded by  

• Solder Bump Deposition Using a Laser Beam
  Won-Suk Choi, Jea-Woon Kim, Jong-Hyeong Kim, Joo-Han Kim
  Transactions of the Korean Society of Mechanical Engineers A.2012; 36(1): 37.     CrossRef
• Laser-assisted deposition of Cu bumps for microelectronic packaging
  Won-Seok CHOI, Joohan KIM
  Transactions of Nonferrous Metals Society of China.2012; 22: s683.     CrossRef