The rapid proliferation of artificial intelligence (AI) servers and high-performance computing systems has significantly elevated the technical and reliability requirements for multilayer ceramic capacitors (MLCCs). In such systems, MLCCs are critical passive components that must deliver high capacitance, fast transient response, and robust insulation performance under high temperature, voltage, and current density. This review examines the material, structural, and process innovations that underpin MLCC performance in AI applications. Key topics include the development of ultrathin dielectric layers (<0.5 μm), rare-earth doped BaTiO₃-based dielectrics with enhanced DC bias stability, and core-shell microstructures designed for temperature and field resilience. The paper also explores insulation degradation mechanisms―such as vacancydriven conduction and demixing―and advanced reliability assessment methodologies, including HALT, TSDC, and the tipping point framework. Comparisons with automotive-grade MLCCs highlight the unique requirements of AI systems, such as ultraminiaturization, high volumetric efficiency, and ppm-level field failure rates. Finally, the review discusses emerging trends in MLCC technology, including particle engineering, interface stabilization, and advanced lamination techniques, and provides insight into the future direction of capacitor development tailored to AI data center environments.

Multilayer ceramic capacitors (MLCCs) are essential for high-capacitance, miniaturized, and reliable electronic applications. This study examines the impact of layer stacking on the dielectric and electrical properties of MLCCs using a BaTiO₃-based dielectric with MgO, Mn₃O₄, Yb₂O₃, V₂O₅, and (BaCa)SiO₃ glass additives. MLCCs with 10 um-thick dielectric layers and varying Ni electrode layers (10, 30, 50, and 100 layers) were fabricated. The dielectric constant increases significantly up to 30 layers due to compressive stress and sintering densification but it becomes linear beyond 30 layers. Dissipation factor and ESR decrease with higher stacking due to improved sinterability, while breakdown voltage declines exponentially from defect accumulation and thermal stress. Insulation resistance decreases but stabilizes relative to capacitance. C-V results show stress-induced polarization suppression, which reduces the dielectric constant under high voltage. Optimized stacking and sintering conditions are crucial for MIL-PRF-32535 compliant MLCC designs.

This study examined the crystallinity and potential of BaTiO₃ powder, prepared by hydrothermal synthesis at 60 nm, as a dielectric material for automotive MLCCs under varying heat treatment temperatures. At temperatures above 850℃, the powder exhibited an orthorhombic structure, with crystallinity and particle size increasing as the temperature rose. In the range of 850~900℃, the powder displayed a uniform particle size distribution and minimal agglomeration, with particles ranging between 150~200 nm. Additionally, it was confirmed that the heat treatment temperature significantly impacts the properties of BaTiO₃ powder, which are critical for the dielectric performance required in X7R MLCCs used in automotive applications. Specifically, high-temperature treatment (above 850℃) was essential for enhancing the powder's crystallinity and forming a stable core-shell structure, which is crucial for achieving stable TCC (Temperature Coefficient of Capacitance) characteristics. It was confirmed that increased crystallinity at temperatures above 850℃ facilitated the development of the core-shell structure through interactions with additives, thereby achieving the necessary characteristics required for highly reliable automotive MLCCs.