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"Multi-layer circuit board"

Fabrication of LTCC Multi-layer Circuit Board made of Glass-Al2O3 Composites
Hun Kwak, Hyung Do Jeon, Hwan Kim, Won Jae Lee, Byoung Chul Shin, Il Soo Kim
J Korean Inst Electr Electron Mater Eng 2008;21(6):509-516.   Published online June 1, 2008
DOI: https://doi.org/10.4313/JKEM.2008.21.6.509

Citations

Citations to this article as recorded by  
  • Improving bending strength of LTCC materials with low dielectric loss by structural design
    Huaizhi Wang, Yue Leng, Yaoyi Chen, Haiyi Peng, Haishen Ren, Tianyi Xie, Huixing Lin, Fancheng Meng
    Journal of Electroceramics.2022; 49(3-4): 109.     CrossRef
  • A study on the application of Rogowski coil on the LTCC
    Sung-Hyun Park, Eun-Sup Kim, Byoung-Chul Shin
    Journal of Sensor Science and Technology.2010; 19(6): 475.     CrossRef
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