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"Microlens"

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"Microlens"

Micro Light-Emitting Diodes with 3D-Printed Hydrogel Microlens for Optical Property Enhancements
Yujin Ko, Jeong Hyeon Kim, Sang Yoon Park, Kang Hyeon Kim, Seong Min Hong, Bo-yeon Lee, Han Eol Lee
J Electr Electron Mater 2024;37(5):554-561.   Published online September 1, 2024
DOI: https://doi.org/10.4313/JKEM.2024.37.5.13
Micro light-emitting diodes (μLEDs) have been utilized in various fields such as displays, and smart devices, due to their superior stabilities. Since the applications of the μLEDs have been extended to medical devices and wearable sensors, excellent optical properties and uniformity of the μLEDs are important. Hence, several researchers have investigated to enhance the optical efficiency of the μLEDs through micro/nano lens. However, the reported methods for realizing the micro/nano lens have some drawbacks such as complex and high-cost manufacturing processes. Herein, we developed μLEDs with 3D-printed hydrogel microlenses. The printed hydrogel had high transparency and excellent adhesive strength, allowing it to attach onto top surface of the μLEDs without any additional adhesives. Microscale printing technology using a 3D printer achieved quick and fine printing in desired shapes and arrangements, showing the possibility of mass production. The 3D-printed microlens can be applied to improve not only the optical properties of μLEDs but also other optical devices.
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Improvement of Outcoupled Light Efficiency of Organic Light-emitting Diodes with a Use of Microlens Array
Hye Sook Kim, Deok Hyon Hwang, Jin Woong Hong, Min Jong Song, Wone Keun Han, Tae Wan Kim
J Electr Electron Mater 2014;27(5):307-311.   Published online May 1, 2014
Because of a waveguiding effect and total internal reflection caused by a difference inrefractive indices, only 20% of generated light is emitted to the air and the rest is trapped or absorbed inthe device. An improvement of outcoupled efficiency of organic light-emitting diodes was studied using amicrolens array. Mold of microlens array was fabricated by using photo-lithography with the AZ9260photoresist, and the microlens array was formed onto the glass substrate using the UV curing agentnamed ZPU13-440. Device structure consists of microlens/glass/ITO/TPD/Alq3/LiF/Al. It was found thatthere is an improvement of external quantum efficiency by about 20% at the same current density for thedevice with the microlens array compared to that of the reference one. Simulated outcoupled efficiencyshows the improvement by about 20% for the device with the microlens array compared to that of thereference one. These results are consistent with the experimental ones
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Simulation of Microlens Array for the Improvement of Outcoupled Efficiency of Organic Light-emitting Diodes
Deok Hyeon Hwang, Hye Sook Kim, Won Jae Lee, Seung Hun Lee, Tae Ho Lee
J Electr Electron Mater 2013;26(10):745-753.   Published online October 1, 2013
Performance of organic light-emitting diodes incorporating microlens array was simulated using a Light Tools software. Use of microlens array can help the light to escape out of the device. We simulated a reference device that is consisted of reflection layer, emissive layer, and flat transparent substrate. And in this reference device, outcoupled efficiency of 22% was obtained. Several shapes of microlens were applied such as hemisphere, trapezoid, cone, and rectangular parallelepiped. The results showed the improvement of outcoupled efficiency of the device with microlens compared to that of the reference one. And from the analyses of the simulated data, the obtained appropriate shape of microlens is hemisphere, and the improvement of the device with hemispherical lens is 57% higher than that of the reference one.
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Pixel FPN Characteristics with Color-Filter and Microlens in Small Pixel Generation of CMOS Image Sensor
Hi Deok Lee, Woon Il Choi
J Electr Electron Mater 2012;25(11):857-861.   Published online November 1, 2012
FPN (fixed-pattern-noise) mainly comes from the device or pattern mismatches in pixel and color filter, pixel photodiode leakage in CMOS image sensor. In this paper, optical stack module related pixel FPN was investigated and the classification of pixel FPN contribution with the individual optical module process was presented. The methodology and procedure would be helpful in reducing the greater pixel FPN and distinguishing the complex FPN sources with respect to various noise factors.
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