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"Metallic glass"

Research for Solder Paste in Metallic Glass System for Thermoelectric Modules
Seung-ho Seo, Geun Sik Son, Kang Hyun Seo, Soon-mok Choia
J Electr Electron Mater 2018;31(4):249-254.   Published online May 1, 2018
We researched about a bulk metallic glass system as an additive to an Ag paste for high temperature thermoelectric modules. Bulk metallic glass (BMG) ribbons were produced by using a rapid solidification process (RSP) under a cooling rate condition higher than 10℃/sec. We investigated BMG characteristics of the ribbons by means of x-ray diffraction (XRD) and differential scanning calorimetry (DSC) in order to evaluate the glass transition temperature (Tg) and the recrystallization temperature (Tx) lower than 400℃. A milling process was also developed to apply the BMG ribbons to a commercial Al paste as an additive for lower sintering temperature.
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