[(Co1-xCux)0.2(Ni0.3Mn0.7)0.8]3O4 (0≤x≤1) thin films prepared by metal organic decomposition process were fabricated on SiN/Si substrate for infrared sensor application. Their structural and electrical properties were investigated with variation of Cu dopant. The [(Co1-xCux)0.2(Ni0.3Mn0.7)0.8]3O4 (CCNMO) film annealed at500℃ exhibited a dense microstructure and a homogeneous crystal structure with a cubic spinel phase. Theircrystallinity was further enhanced with increasing doped Cu amount. The 120 nm-thick CCNMO (x=0.6) thin film had a low resistivity of 53 Ω·cm at room temperature while the Co-free film (x=1) showed a significantly decreased resistivity of 5.9 Ω·cm. Furthermore, the negative temperature coefficient of resistance(NTCR) characteristics were lower than -2%/℃ for all the specimens with x≥0.6. These results imply that the CCNMO (x≥0.6) thin films are a good candidate material for infrared sensor application.

Copper manganite thin films were fabricated on SiNx/Si substrate by metal organic decomposition (MOD) process. They were burned-out at 400℃ and annealed at various temperatures (400∼800℃) for 1h in ambient atmosphere. Their micro-structure and negative temperature coefficient of resistance (NTCR) characteristics were analyzed for micro-bolometer application. The copper manganitefilm with a cubic spinel structure was well developed at 500℃ which confirmed by XRD and HRTEM analysis. It showed a low resistivity (47.5 Ω·cm) at room temperature and high NTCR characteristics of-4.12%/℃ and -2.15%/℃ at room temperature and 85℃, implying a good thin film for micro-bolometer application. Furthermore, its crystallinity was enhanced with increasing temperature to 600℃. However, the appearance of secondary phase at temperatures higher than 600℃ lead to deteriorate the NTCR characteristics.