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"Intermetalic compound"

A Study of the IMC Growth and Shear Strength of Solder Bump and TiW/Cu/electroplating Cu UBM
Ui Gu Jang, Nam Hun Kim, Nam Gyu Kim, Jun Cheol Eom
J Electr Electron Mater 2004;17(3):267-271.   Published online March 1, 2004
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