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"Inductor"

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"Inductor"

Effect of Dispersant and Silane on Dispersion of Magnetic Powder Paste
Chang Hyun Lee, Hyo Soon Shin, Dong Hun Yeo, Sahn Nahm
J Electr Electron Mater 2019;32(1):25-29.   Published online January 1, 2019
Various process technologies for manufacturing power inductors are under development. The core goal is to increase the mixing ratio of the soft magnetic powder in the epoxy, and to uniformly disperse it in a molding-type power inductor, manufactured by the injection molding method. In this study, we investigated the effect of dispersant and silane on the dispersion of soft magnetic metal powders in epoxy. We added 0.6 wt% of dispersant and 2.0 wt% of silane, and an excellent dispersibility resulted. Under the conditions of 0.3 wt% of dispersant and 0.5 wt% of silane, we added both dispersant and silane together to observe the effect of their interaction on dispersibility. Similarly, the addition of 0.3 wt% of dispersant and 0.1 wt% of silane resulted in a sharp increase in viscosity, considered to be due to the interaction of the dispersant and silane. The addition of 0.1 wt% of dispersant with 0.5 wt% of silane resulted in a sharp rise in viscosity, and sedimentation-height decreased sharply due to the dispersion optimization.
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The Effect of Silane and Dispersant on the Packing in the Composite of Epoxy and Soft Magnetic Metal Powder
Chang Hyun Lee, Hyo Soon Shin, Dong Hun Yeo, Sahn Nahm
J Electr Electron Mater 2017;30(12):751-756.   Published online December 1, 2017
A molding-type power inductor is an inductor that uses a hybrid material that is prepared by mixing a ferrite metal powder coated with an insulating layer and an epoxy resin, which is injected into a coil-embedded mold and heated and cured. The fabrication of molding-type inductors requires various techniques such as for coil formation and insertion, improving the magnetic properties of soft magnetic metal powder, coating an insulating film on the magnetic powder surface, and increasing the packing density by well dispersing the powder in the epoxy resin. Among these aspects, researches on additives that can disperse the metal soft magnetic powder having the greatest performance in the epoxy resin with high charge have not been reported yet. In this study, we investigated the effect of silanes, KBM-303 and KBM-403, and a commercial dispersant on the dispersion of metal soft magnetic powders in epoxy resin. The sedimentation height and viscosity were measured, and it was confirmed that the silane KBM-303 was suitable for dispersion. For this silane, the packing density was as high as about 72.49%. Moreover, when 1.2 wt% of dispersant BYK-103 was added, the packing density was about 80.5%.
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The Variation of Packing Density According to Powder Size Distribution and Epoxy Resin in Soft Magnetic Composite
Chang Hyun Lee, Sea Moon Oh, Hyo Soon Shin, Dong Hun Yeo, Jin Ho Kim
J Electr Electron Mater 2017;30(12):782-787.   Published online December 1, 2017
There is growing interest in power inductors in which metal soft magnetic powder and epoxy resin are combined. In this field, the process technology for increasing the packing density of magnetic particles in an injection molding process is very important. However, little research has been reported in this regard. In order to improve the packing density, we investigated and compared the sedimentation heights of pastes for three types of soft magnetic alloy powders as a function of the mixing ratios and the type of resin used. Experimental results showed that the packing density was the highest (71.74%) when the mixing ratio was 80:16:4 (Sendust:Fe-Si:CIP) according to the particle size using an SE-4125 resin. In addition, the packing density was found to be inversely related to the layer separation distance. As a result, it was confirmed that the dispersion of solid particles in the paste was important for curing; however, the duration of the curing process can greatly affect the packing density of the final composite.
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Thin Films and Sensors : A Study on Improvement of FBAR Duplexer for Wireless Systems
Eun Kyu Lee, Hyung Rim Choi
J Electr Electron Mater 2010;23(5):388-396.   Published online May 1, 2010
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RF High Power Amplifier Module using AIN Substrate
Seung Yong Kim, Choong Mo Nam
J Electr Electron Mater 2009;22(10):826-831.   Published online October 1, 2009
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High Frequency Simulations for the Meander Type Inductors on the MgO and Al2O3 Substrates
Yong Su Ham, Sung Hun Kim, Ey Goo Kang, Jung Hyuk Koh
J Electr Electron Mater 2009;22(8):641-644.   Published online August 1, 2009
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Demonstration of MEMS Inductor on the LTCC Substrate
J Electr Electron Mater 2007;20(12):1049-1055.   Published online December 1, 2007
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Fabrication of Micromachined On-chip High Ratio Air Core Solenoid Inductor
Jeong Bong Lee
J Electr Electron Mater 2006;19(8):780-784.   Published online August 1, 2006
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Optimal Design of Spiral Inductors on Silicon Substrates for RF ICs
J Electr Electron Mater 2005;18(3):216-218.   Published online March 1, 2005
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Superconduetor,Magnetic Materials : Development of High-Performance Ultra-small Size RF Chip Inductors
Ui Jung Yun, Chae Il Cheon
J Electr Electron Mater 2004;17(3):340-347.   Published online March 1, 2004
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Characterization of Embedded Inductors using Partial Element Equivalent Circuit Models
Dong Wook Shin, Chang Hoon Oh, Kyu Bok Lee, Jong Kyu Kim, Il Gu Yun
J Electr Electron Mater 2003;16(5):404-408.   Published online May 1, 2003
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Display : Fully CMOS-compatible Process Integration of Thin Film Inductor with a Sputtered Bottom NiFe Core
II Yong Park, Sang Gi Kim, Jin Gun Koo, Tae Moon Roh, Dae Woo Lee, Jong Dae Kim
J Electr Electron Mater 2003;16(2):138-143.   Published online February 1, 2003
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Enhancement of Q Factor in Parallel-Branch Spiral Inductors
Dong Woo Suh, Bong Ki Mheen, Jin Young Kang, Mun Cheol Paek
J Electr Electron Mater 2003;16(1):83-87.   Published online January 1, 2003
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