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"High deposition rate"

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"High deposition rate"

Process Characteristics of SiOx and SiOxNy Films on a Gas Barrier Layer using Facing Target Sputtering (FTS) System
Jin Woon Son, Yong Jin Park, Sun Young Sohn, Hwa Min Kim
J Korean Inst Electr Electron Mater Eng 2009;22(12):1028-1032.   Published online December 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.12.1028
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Characteristics of SiOx Gas Barrier Films as a Function of Process Conditions in Facing Target Sputtering (FTS) System
Kang Bae, Tae Hyun Wang, Sun Young Sohn, Hwa Min Kim, Jae Suk Hong
J Korean Inst Electr Electron Mater Eng 2009;22(7):595-601.   Published online July 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.7.595
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