Smart electronic skin (E-skin) is an emerging technology that integrates electronic devices with human skin, enhancing human-machine interactions. One critical challenge in its development is effective thermal management to ensure device reliability, longevity, and user comfort. This review highlights passive cooling techniques - thermal conduction, convection, radiation, and phase-change materials - as key strategies to address this challenge without additional power consumption. These integrated mechanisms have demonstrated the ability to efficiently dissipate heat, preventing thermal buildup and maintaining optimal performance in E-skin devices. Recent advancements indicate that combining these methods can significantly enhance the thermal management of flexible electronics. Future research should focus on refining these materials and techniques to overcome challenges related to cost, durability, and environmental stability, thereby advancing the practical application of E-skin technology.

Recently, with the development of the smart device market, the integration of high-functional devices has increased the heat density, causing overload of the device, and resulting in various problems such as shortened lifespan, performance degradation, and failure. Therefore, research on heat dissipation materials is being actively conducted to realize next-generation electronic products. The heat dissipation material is characterized in that it is easy to dissipate heat due to its high thermal conductivity and minimizes leakage current flowing through the heat dissipation material due to its low electrical conductivity. In this study, flower-shaped Al₂O₃ and BN composites were engineered with a simple hydrothermal synthesis approach, and their thermal conductivity characteristics were compared and evaluated for each synthesis condition for the application to a heat dissipation material. Spherical BN and flower-shaped Al₂O₃ were easily obtained, and SEM/EDS analyses confirmed the uniform presence of BN between the Al₂O₃, and it can be expected that these shapes can affect the thermal conductivity.

An increase in the temperature of photovoltaic (PV) modules causes reduced power output and shorter lifetime. Because of these characteristics, demands for the heat dissipation of PV modules are increasing. In this study, we attached a heat dissipation sheet to the back sheet of a shingled PV module and observed the temperature changes. The PV shingled module was tested under Standard Test Conditions (STCs; irradiance: 1,000 W/m², temperature: 25℃, air mass: 1.5) using a solar radiation tester, wherein the temperature of the PV module was measured by irradiating light for a certain duration. As a result, the temperature of the PV module with the heat dissipation sheet decreased by 3℃ compared to that without a heat dissipation sheet. This indicated that the power loss was caused by a temperature increase of the PV module. In addition, it was confirmed that the primary parameter contributing to the reduced PV module output power was the open circuit voltage (Voc).

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by 25℃ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below 55℃ when the optimal heat dissipation design was applied.

This is the study on the development of fusion heat dissipation of carbon magnesium materials. The purpose of this study is for effective utilization of heat emission which is the core of LED lighting. The result of study enabled the derivation of side satisfying result of making the surface temperature of lighting to be below 70℃ (actual measurement: 58℃) using magnesium. The lighting products that use magnesium was made possible based on the result of this study. Also from the performance aspect such as light distribution, the measurement of light efficiency demonstrated the level of 90 lm/W. Therefore the commercialization of lighting was made possible and the efficiency could be further enhanced by supplementation of LED performance.

Abstract: To study the encapsulation method for heat dissipation of high brightness organic light emitting diode (OLEI)), red emitting OLED of ITO (150 nm) / 2 TNATA (50 rim) / NPB (30 rim) / A1q3 1 vol.% Rubrene (30 nm) / Alq3 (30 nm) / LiF (0.7 nm) / Al (200 nm) structure was fabricated, which on Alq3 (150 nm) / LiF (ISo nm) as buffer layer and Al as protective layer was deposited to protect the damage of OLED, and subsequently it was encapsulated using attaching film and metal sheet. The current density, luminance and power efficiency was improved according to thickness of Al protective layer. The emission spectrum and the Commission International de L`Eclairage (CIE) coordinate did not have any effects on encapsulation process using attaching film and metal sheet The lifetime of encapsulated OLED using attaching film and metal sheet was 307 hours in 1,200 nm Al thickness, which was increased according to thickness of Al protective layer, and was improved 7% compared with 287 hours, lifetime of encapsulated OLEI) using attaching film and flat glass. As a result, it showed the improved current density, luminance, power efficiency and the long lifetime, because the encapsulation method using attaching film and metal sheet could radiate the heat on OLED effectively.

An efficient cooling system is essential for the electronic packaging such as a high-luminance LED lighting. A special heat transport technology, Pulsating Heat Pipe (PHP), can be applied to the cooling of LED lighting. In this paper, the operational characteristics of the PHP in the imposed thermal boundary conditions of LED lighting were experimentally investigated. The experimental PHP was made of copper tubes of internal diameter of 2.1 mm. The working fluids of ethanol, FC-72, water, acetone and R-123 were chosen for comparison. The results showed that an optimum range of charging ratio exists for high cooling performance; 50% for most of the fluids. Among the five working fluids, water showed the highest heat transfer rate of 260 W. Two distinguished characteristics of pulsating direction were identified. It is also identified that high vapor pressure gradient is one of key parameters for better heat transfer performance.