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"Heat conduction"

Regular Paper : Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module
Won Kyu Chae, Young Park, Sam Young Kwan, Jae Hyeong Lee
J Electr Electron Mater 2016;29(2):125-130.   Published online February 1, 2016
In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by 25℃ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below 55℃ when the optimal heat dissipation design was applied.
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