Conductive inks are essential for developing flexible and wearable electronic devices, where printability and electrical performance must be finely balanced. However, achieving high conductivity while minimizing costly silver filler content remains a key challenge in ink formulation. In this work, we demonstrate that a simple ball-milling process transforms spherical silver particles into platelet-shaped fillers, dramatically enhancing conductivity at equivalent filler loading. The resulting inks show a reduction in sheet resistance from ~180 Ω/□ to ~ 0.57 Ω/□ at 70 wt% filler content, with improved performance attributed to surface-to-surface contact between platelets. Moreover, we show that filler content influences not only electrical conductivity but also ink viscosity, with the 53.8 wt% formulation achieving a practical balance between conductivity, processability, and cost. This morphology- and composition-controlled ink design offers a scalable strategy for manufacturing high-performance, cost-effective conductive inks suitable for next-generation printed electronics.

In this study, an epoxy insulation barrier for high voltage GIS was developed using epoxy and a filler with a Young`s modulus of 11 GPa. The material was investigated using a simulation of the principal stress, displacement, and safety factors while optimizing the profile shape. The simulation showed that thelarger Young`s modulus of the Al₂O₃ filler compared to the SiO₂ in the epoxy insulation can contribute to an increase in resistance to mechanical fracturing for theoptimized profile barrier in high voltage GIS. In addition, the safety factor was improved by 10%. It can be concluded that the mechanical fracturing properties of the insulation barrier can be enhanced by increasing the content of the elastic filler, Al₂O₃, for high voltage GIS applications.

In this study, we developed a lead-free P_{2}`O_{5}`-V_{2}O_{5}-ZnO glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to 45.4×10^{-7}/℃, which is very close to that of the glass substrate (44.0×10^{-7}/℃). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.

Some insulating materials are organized and analyzed with variables to obtain the optimized profile of encapsulated three phase of epoxy barrier which is applied to gas compartment and supporting conductors for high voltage GIS (gas insulated switchgear). The high voltage GIS is used in electrical power system and operating reliability. In this paper, optimization possibility of barrier shape including both electrical insulation performance and mechanical strength, premised on that condition minimizing volume and light weight should be kept for high voltage GIS, could be achieved by analysis simulation. As a result, filling material which is lower permittivity such as SiO2 instead of Al2O3 properly to the epoxy material, can be improved to increase the electrical insulation performance and mechanical strength for an optimized profile barrier of a high voltage GIS.

In this thesis, the silicone filler with a sample size of 0∼75 phr and void size of 2∼4.5 mm is prepared in order to diagnose the defect of void which exists in widely used insulation material, silicone rubber. In this silicone rubber sample, electrodes are connected and whilst the voltage changes, applied voltage 7 kV∼9 kV is increased constantly over time and discharge quantity, discharge frequency and applied voltage (T-QNV) were measured. The discharge quantity of the applied voltage (VQ) is measured to estimate inception voltage and extinction voltage. In addition, under the condition of maintaining constant applied voltage, discharge quantity and discharge frequency (QN) are measured, and its characteristics are analyzed.

We investigated the dielectric and mechanical properties of ceramic polymer composite xBNT - (1-x)LCP (x= 0, 10, 20, 30, 40 vol.%). The disk shaped BNT (BaNd2Ti4O12) - LCP (liquid crystal polymer) composite samples were prepared by compression molding method. With increasing the BNT content in composites from 10 to 40 vol.%, the dielectric constant increased but the dielectric loss as well as bending strength of composites reduced. These composites were well described with modified Lichtenecker`s model having k = 0.392 and 0.303 for the first and second ball milled BNT filled composites, which means that the BNT filler in composites are well dispersed. The dielectric constant of the composite comprised of the second milled BNT (D50 = 1.39 um) was higher that of the composite of the first milled BNT (D50= 2.45 um), which seems to be related with the different particle size and dispersion of BNT fillers in LCP matrix. The bending strength of the composite containing the second milled BNT was superior to that of the composite of the first milled BNT.