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"Facing target sputtering"

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"Facing target sputtering"

The Electrical and Optical Properties of Ga-doped ZnO Films Prepared by Using Facing Target Sputtering System
Myung Gyu Chol, Kang Bae, Sung Bo Seo, Dong Young Kim, Hwa Min Kim
J Electr Electron Mater 2013;26(5):385-390.   Published online May 1, 2013
(Ga203)x(ZnO)100-x, (GZO) films were prepared at room temperature by using a facing target sputtering (FTS) system and their electrical resistivites was investigated as a function of the Ga203 content. The GZO film with an atomic ratio of Ga203 of x 7 wt. %, shows the lowest resistivity of 7.5 X 10-4 cm. The GZO films were also prepared at various substrate temperatures from room temperature to 300t, and their electrical resistivity was found to be improved as the substrate temperature was increased, A very low resistivity of 2.8x 10u1 n that is almost comparable with that of ITO film was obtained in the GZO films prepared at the substrate temperature of 300t by using the FTS.
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Process Characteristics of SiOx and SiOxNy Films on a Gas Barrier Layer using Facing Target Sputtering (FTS) System
Jin Woon Son, Yong Jin Park, Sun Young Sohn, Hwa Min Kim
J Electr Electron Mater 2009;22(12):1028-1032.   Published online December 1, 2009
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Characteristics of SiOx Gas Barrier Films as a Function of Process Conditions in Facing Target Sputtering (FTS) System
Kang Bae, Tae Hyun Wang, Sun Young Sohn, Hwa Min Kim, Jae Suk Hong
J Electr Electron Mater 2009;22(7):595-601.   Published online July 1, 2009
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Properties of ZrO2 Gas Barrier Film using Facing Target Sputtering System with Low Temperature Deposition Process for Flexible Displays
Ji Hwan Kim, Do Hyun Cho, Sun Young Sohn, Hwa Min Kim, Jong Jae Kim
J Electr Electron Mater 2009;22(5):425-430.   Published online May 1, 2009
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