Journal of Electrical and Electronic Materials

"FR4 PCB"

Regular Paper : Analysis of Thermal Properties in LED Package by Via-hole and Dimension of FR4 PCB: Sung Hyun Kim, Se Il Lee, Jong Kyung Yang, Dae Hee Park; J Korean Inst Electr Electron Mater Eng 2011;24(3):234-239. Published online March 1, 2011; DOI: https://doi.org/10.4313/JKEM.2011.24.3.234

Abstract
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In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 [mm2]. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.

Citations

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