This review examines the principles, limitations, and recent advancements in elastic modulus measurement using nanoindentation. The importance of accurate contact area prediction is discussed, along with the Oliver-Pharr method and its limitations. The Continuous Stiffness Measurement (CSM) technique is presented as a significant improvement, allowing continuous measurement of mechanical properties throughout the indentation process. For ultra-thin films, the Li and Vlassak method, which incorporates Yu's solution and the concept of effective thickness, is highlighted as a means to correct for substrate effects. Recent developments in artificial neural network-based models for elastic modulus prediction are also explored. These advancements have greatly expanded the applicability of nanoindentation in semiconductor and MEMS device reliability assessment.

We investigated the tribological properties of amorphous carbon (a-C) films deposited with CrC interlayers of various thicknesses as the adhesive layer. A-C and CrC thin films were deposited using the unbalanced magnetron (UBM) sputtering method with graphite and chromium as the targets. CrC films as the interlayer were fabricated under a-C films, and various structural, surface, and tribological properties of a-C films deposited with various CrC interlayer thicknesses were investigated. With various CrC interlayer thicknesses under a-C films, the tribological properties of CrC/a-C films were improved; the increased film thickness exhibited a maximum high hardness of over 27.5 GPa, high elastic modulus of over 242 GPa, critical load of 31 N, residual stress of 1.85 GPa, and a smooth surface below 0.09 nm at the condition of 30-nm CrC thickness.