Smart electronic skin (E-skin) is an emerging technology that integrates electronic devices with human skin, enhancing human-machine interactions. One critical challenge in its development is effective thermal management to ensure device reliability, longevity, and user comfort. This review highlights passive cooling techniques - thermal conduction, convection, radiation, and phase-change materials - as key strategies to address this challenge without additional power consumption. These integrated mechanisms have demonstrated the ability to efficiently dissipate heat, preventing thermal buildup and maintaining optimal performance in E-skin devices. Recent advancements indicate that combining these methods can significantly enhance the thermal management of flexible electronics. Future research should focus on refining these materials and techniques to overcome challenges related to cost, durability, and environmental stability, thereby advancing the practical application of E-skin technology.