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"Diffusion barrier"

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"Diffusion barrier"

Formation of TiN by Ti Nitridation in NH3 Ambient
Geun U Lee, Su Jin Park, Jeong Ju Yu, Yeong Ho Kwon, Ju Yeon Kim, Hyeong Tag Jeon, Gyu Sig Bae
J Korean Inst Electr Electron Mater Eng 2004;17(2):150-155.   Published online February 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.2.150
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A Study on the Diffusion Barrier Properties of Pt/Ti and Ni/Ti for Cu Metallization
Sung Keun Chang
J Korean Inst Electr Electron Mater Eng 2003;16(2):97-101.   Published online February 1, 2003
DOI: https://doi.org/10.4313/JKEM.2003.16.2.097
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