Skip to main navigation Skip to main content
  • KIEEME

J Electr Electron Mater : Journal of Electrical and Electronic Materials

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Page Path

3
results for

"Conductive film"

Keywords

Publication year

Authors

"Conductive film"

We have studied commercialization and process optimization of protective film on transparent conductive coated substrate, nano silver on flexible PET (poly ethylene terephthalate), by means of roll-to-roll micro-gravure coater. Nanosilver on flexible PET substrate is potential materials to replace ITO (indium tin oxide). Protective film is most important to maintain unique silver pattern on top of transparent PET. PSA pressure sensitive adhesives) was developed solely for nano silver on PET and protective film was successfully laminated. We have optimized all process conditions such as coating thickness, line speed and aging time & temperature via experimental design. Transparent conductive film and its protective film developed in this research are commercially available at this moment.
  • 9 View
  • 0 Download
Energy Materials : Characterization of Low-temperature Conductive Films Bonded PV Modules and Its Field Test
Su Wung Baek, Kwang Il Choi, Suk Ho Lee, Chan Hyuk Cheon, Seung Min Hong, Kil Song Lee, Hyun Woo Shin, Yeon Won Yang, Cheol Hyun Lim
J Electr Electron Mater 2014;27(3):189-194.   Published online March 1, 2014
In this paper, PV modules using a low-temperature conductive film(LT-CF) as a bonding material between a cell and a solder free ribbon were produced and chracterized, which is more environmental-friendly, cost effective and high efficient. Mainly, filed electrical performance of PV modules using three different types of bonding material; a convetional solder ribbon(SR), a LT-CF and a light-capturing Ribbon(LCR) were compared to comfirm the feasibility of LT-CF as a bonding material. The filed test were conducted for 3 months and results were discussed in terms of amount of output energy production and efficiency.
  • 7 View
  • 0 Download
A Study on Thermosonic Bonding Process and Its Reliability Evaluation of Joints
Young Eui Shin, Jin Suk Park, Sun Eik Son
J Electr Electron Mater 2009;22(8):625-631.   Published online August 1, 2009
  • 7 View
  • 0 Download