SMD-type 660 nm wavelength semiconductor laser diode device is fabricated using silicon resin molding technology and fabricated a BT resin printed circuit board. BT resin electrode structure printed circuit boards with soldering electrode pads and through holes for heat dissipation were fabricated. The SMD process is an injection molding technique in which the chip is molded from silicon material and then cut by a dicing process to complete the beam emission surface. The fabricated SMD-type semiconductor laser diode exhibits a good near-field beam pattern with no scattering/dispersion caused by the printed circuit board or silicon molding in the emitted laser beam, or reflections around the chip. It was also confirmed that the heat generated at 20 mA operation has good heat dissipation characteristics through the through-hole heat dissipation structure.

Citations

• Mitigating Contact‐Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al2O3/Epoxy Composites
  Yeonwook Jeong, Sabina Ghorsaine, Chan‐Jae Lee, In Kim, Mooho Lee, Hyejeong Lee, Ginam Kim, Jong‐Woong Kim
  Small.2026;[Epub]     CrossRef

This study proposes an innovative methodology for developing flexible printed circuit boards (FPCBs) capable of conforming to three-dimensional shapes, meeting the increasing demand for electronic circuits in diverse and complex product designs. By integrating a traditional flat plate-based fabrication process with a subsequent three-dimensional thermal deformation technique, we have successfully demonstrated an FPCB that maintains stable electrical characteristics despite significant shape deformations. Using a modified polyimide substrate along with Ag flake-based conductive ink, we identified optimized process variables that enable substrate thermal deformation at lower temperatures (~130℃) and enhance the stretchability of the conductive ink (ε ~30%). The application of this novel FPCB in a prototype 3D-shaped sensor device, incorporating photosensors and temperature sensors, illustrates its potential for creating multifunctional, shape-adaptable electronic devices. The sensor can detect external light sources and measure ambient temperature, demonstrating stable operation even after transitioning from a planar to a three-dimensional configuration. This research lays the foundation for next-generation FPCBs that can be seamlessly integrated into various products, ushering in a new era of electronic device design and functionality.

Recently, energy harvesting technologies are considered as the great alternatives to reduce the dependency on secondary batteries. In this paper, we proposed PCB type energy harvester which can be directly integrated with other electronic components on same board. To form the three dimensional coil structure, two PCBs with patterned metal lines are solder bonded. For magnetic induction, inside of coil structure was filled with magnetic substance and rotary motioned external magnets are applied to near the harvester. The effects of metal wire width on PCB, thickness of magnetic substance, and frequency of rotary motion on energy harvesting performance are analyzed by computer simulation and experiments. Experimental results showed 29.89 ㎼ of power generation performance at the frequency of 5.2 Hz and it is shown that designed harvester can be effectively applied on vibration environment with very limited frequency.

Citations

• Improving bending strength of LTCC materials with low dielectric loss by structural design
  Huaizhi Wang, Yue Leng, Yaoyi Chen, Haiyi Peng, Haishen Ren, Tianyi Xie, Huixing Lin, Fancheng Meng
  Journal of Electroceramics.2022; 49(3-4): 109.     CrossRef
• A study on the application of Rogowski coil on the LTCC
  Sung-Hyun Park, Eun-Sup Kim, Byoung-Chul Shin
  Journal of Sensor Science and Technology.2010; 19(6): 475.     CrossRef