By introducing curing kinetics and chemo-rheology for the epoxy resin formulation for ultra-high voltage gas insulated switchgear (GIS) Insulating Spacers, a study was conducted to simulate the curing behavior, flow and warpage analysis for optimization of the molding process in automatic pressure gelation. The curing rate equation and chemo-rheology equation were set as fixed values for various factors and other physical property values, and the APG molding process conditions were entered into the Moldflow software to perform optimization numerical simulations of the three-phase insulating spacer. Changes in curing shrinkage according to pack pressure were observed under the optimized process conditions. As a result, it was confirmed that the residence time in the solid state was shortened due to the lowest curing reaction when the curing holding pressure was 3 bar, and the occurrence of deformation due to internal residual stress was minimized.

The gas insulation switchgear, which is a device for protecting a power system, cannot be supported by the insulation gas itself in a charge unit stored in a metal container. Therefore, molding technology is required to manufacture a gas insulation switch spacer. The APG method injection molding simulation was performed by applying the variables obtained through the physical properties of an epoxy composite used for manufacturing an insulating spacer to a moldflow software. After varying the temperature conditions of heater in the simulation, the thermal characteristics and the degree of hardening of the spacer were analyzed, based on which the optimum process conditions are presented.