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"Adhesive"

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"Adhesive"

Eco-Friendly Electrically Conductive Adhesives: Silver Optimization for High Performance and Sustainability
Eunae Jo, Chaehwan Jeong
J Korean Inst Electr Electron Mater Eng 2025;38(3):319-323.   Published online May 1, 2025
DOI: https://doi.org/10.4313/JKEM.2025.38.3.12
The growing demand for miniaturized, lightweight, and sustainable electronic devices has intensified the need for advanced bonding materials. Existing electrically conductive adhesives (ECAs) often rely on high silver (Ag) content, resulting in elevated costs and environmental concerns. This study successfully developed a novel ECA with significantly reduced Ag content without compromising essential electrical conductivity and adhesion performance. Experimental results revealed that the optimized ECA demonstrates electrical conductivity comparable to that of commercial products, with notable advantages in cost reduction and eco-friendliness. These advancements position the developed ECA as a promising solution for next-generation electronic manufacturing, contributing to low-carbon technologies and sustainable practices. Future applications could further broaden its use across diverse electronic systems, driving progress in environmentally conscious technologies.
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Study on Shingled String Interconnection for High Power Solar Module
Juhwi Kim, Junghoon Kim, Chaehwan Jeong, Wonyoung Choi, Jaehyeong Lee
J Korean Inst Electr Electron Mater Eng 2021;34(6):449-453.   Published online November 1, 2021
DOI: https://doi.org/10.4313/JKEM.2021.34.6.8
Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.
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Simulation of Shingled String Characteristics Depending on Cell Strips Type for High Power Photovoltaic Modules
Ji Su Park, Won Je Oh, Jae Hyeong Lee
J Korean Inst Electr Electron Mater Eng 2020;33(1):10-15.   Published online January 1, 2020
DOI: https://doi.org/10.4313/JKEM.2021.33.1.3
Recently, with the increase in the use of urban solar power, solar modules are required to produce high power in limited areas. In this report, we proposed the fabrication of a high-power photovoltaic module using shingles technology, and developed accurate string characteristic simulations based on circuit modeling. By comparing the resistance components between the interconnected cells and the cell strips, the ECA resistance was determined to be 0.003 Ω. Based on the equivalent circuit of the modeled shingled string, string simulation was performed according to the type of cell strip. As a result, it was determined that the cell efficiency of the 4-cell strip was the highest at 19.66%, but the efficiency of the string simulated with the 6-cell strip was the highest at 20.48% in the string unit.
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Enhancement of Transmittance and Adhesion of Flexible Display Adhesion Surface by Bubble Removing Process
Jungsoo Kim, Kyungsoo Jang, Cam Phu, Heejun Park, Donggi Shin, Younjung Lee, Junsin Yi
J Korean Inst Electr Electron Mater Eng 2018;31(5):330-334.   Published online July 1, 2018
DOI: https://doi.org/10.4313/JKEM.2018.31.5.330
With the development of the Internet of Things, the use of flexible displays has become widespread. In particular, the use of curved, bendable, and rollable displays is increasing. Flexible display production processes include various important components such as lamination material, flexible substrates, and adhesives. Among them, improvement of the lamination process comprises a large proportion of efforts for further development. In this paper, we attempt to improve the transmittance of the display substrate by performing a bubble removal process after adhesion. The transmittance of the glass substrate with the bubble removal process was 5~12% higher than that of the substrate without the bubble removal process. The fill-strength after the bubble removal process was improved by 21.4%, and the shear-strength was improved by 43.9%.

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  • Evolution of OLED Lamination Technology With Development of Display Form Factors
    Kwan‐Young Han, Ji‐Hoon Park
    Advanced Materials Technologies.2026;[Epub]     CrossRef
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Effect of V2O5 Content and Pre-Sintering Atmosphere on Adhesive Property of Glass Frit for Laser Sealing of OLED
Hyeonjin Jeong, Mijai Lee, Youngjin Lee, Jin Ho Kim, Dae Woo Jeon, Jonghee Hwang, Jungsoo Lee, Yunsung Yang, Sookyung Youk, Tae Ho Park, Yun Gon Moon
J Korean Inst Electr Electron Mater Eng 2016;29(8):489-493.   Published online August 1, 2016
DOI: https://doi.org/10.4313/JKEM.2016.29.8.489
In this study, the effect of vanadium oxide (V2O5) content and pre-sintering atmosphere on sealing property of glass frit that consisted of V2O5-BaO-ZnO-P2O5-TeO2-CuO-Fe2O3 SeO2 was investigated by XPS (X-ray photoelectron spectroscopy). The content of V2O5 was changed to 15, 30, and 45 mol%, and the pre-sintering was carried out in air and N2 condition, respectively. XPS analysis conducted before and after laser irradiation with identical sample. Before laser treatment, glass frits that were pre-sintered at air condition showed both V4+and V5+, but the valence state was changed to V5+ after laser irradiation when the glass frits contained 30 and 45 mol% V2O5; this change led to non-adhesive property. On the other hand, glass frits that were pre-sintered at N2 condition exhibited only V4+ and it showed fine adhesion irrespective of the V2O5 content. As a result, the existence of V4+ seems to be a major factor for controlling the adhesive property of glass frit for laser sealing.
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Thermocompression Anisothropic Conductive Films(ACFs) bonding for Flat Panel Displays(FPDs) Application
Jin Suk Pak, Il Jea Jo, Young Eui Shin
J Korean Inst Electr Electron Mater Eng 2009;22(3):199-204.   Published online March 1, 2009
DOI: https://doi.org/10.4313/JKEM.2009.22.3.199
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Electric and Mechanical Properties of CMC+PTFE Binary Binder Electrode for Electric Double Layer Capacitor
J Korean Inst Electr Electron Mater Eng 2004;17(10):1079-1084.   Published online October 1, 2004
DOI: https://doi.org/10.4313/JKEM.2004.17.10.1079

Citations

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  • Effect of Acid / Heat Treatment on Electric Double Layer Performance of Needle Cokes
    Sun-Hye Yang, Ick-Jun Kim, In-Sik Choi, Hyun-Soo Kim
    Journal of the Korean Electrochemical Society.2009; 12(1): 34.     CrossRef
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