Flexible micro-supercapacitors (MSCs) based on 2D MXenes offer strong potential for next-generation energy storage in wearable and integrated electronics, yet still face critical challenges such as limited energy density, mechanical reliability, and scalable large-area manufacturing. This review surveys recent strategies to address these limitations, with a particular focus on fabrication techniques and wafer-level integration approaches. Wafer-scale processing on both rigid and flexible substrates has emerged as a key milestone toward scalable, high-yield industrial production of flexible MSCs. By examining the strengths and drawbacks of current fabrication strategies, this review highlights essential directions for advancing MXene-based flexible MSCs toward practical and widespread application.