In this letter, we propose and analyze a new asymmetric structure that can be used for next-generation power semiconductor devices. We compare and analyze the electrical characteristics of the proposed device with respect to those of symmetric devices. The proposed device has a p-emitter on the right side of the cell. The peak electric field is reduced by the shielding effect caused by the p-emitter structure. Consequently, the breakdown voltage is increased. The proposed asymmetric structure has an approximately 100% higher Baliga’s figure of merit (~94.22 MW/cm²) than the symmetric structure (~46.93 MW/cm²), and the breakdown voltage of the device increases by approximately 70%.

Thermal effects in bulk and SOI FinFETs are briefly reviewed herein. Different techniques to measure these thermal effects are studied in detail. Self-heating effects show a strong dependency on geometrical parameters of the device, thereby affecting the reliability and performance of FinFETs. Mobility degradation leads to 7% higher current in bulk FinFETs than in SOI FinFETs. The lower thermal conductivity of SiO2 and higher current densities due to a reduction in device dimensions are the potential reasons behind this degradation. A comparison of both bulk and SOI FinFETs shows that the thermal effects are more dominant in bulk FinFETs as they dissipate more heat because of their lower lattice temperature. However, these thermal effects can be minimized by integrating 2D materials along with high thermal conductive dielectrics into the FinFET device structure.

We investigated the effect of a post-annealing process using ultraviolet (UV) light on the electrical properties of solution-processed InZnO (IZO) thin-film transistors (TFTs). UV light was irradiated on IZO TFTs for different time periods of 0s, 30s, and 90s. We measured transfer and retention stability curves to evaluate the performance of the fabricated TFTs. In addition, we measured height, amplitude, and phase AFM images to analyze changes in the surface and morphology of the devices. AFM measurements were performed by setting the drive amplitude of the cantilever tip to 47.9 mV in tapping mode, then dividing the device surface into 500 nm × 500 nm. In the case of IZO TFT irradiated with UV for 30s, the electron mobility and Ion/Ioff ratio were improved, the threshold voltage was reduced by approximately 2 V, and the subthreshold swing also decreased form 1.34 V/dec to 1.11 V/dec.

In this study, we fabricated a metamorphic high-electron-mobility transistor (mHEMT) device with a T-type gate structure for the implementation of W-band monolithic microwave integrated circuits (MMICs) and investigated its characteristics. To fabricate the mHEMT device, a recess process for etching of its Schottky layer was applied before gate metal deposition, and an e-beam lithography using a triple photoresist film for the T-gate structure was employed. We measured DC and RF characteristics of the fabricated device to verify the characteristics that can be used in W-band MMIC design. The mHEMT device exhibited DC characteristics such as a drain current density of 747 mA/mm, maximum transconductance of 1.354 S/mm, and pinch-off voltage of -0.42 V. Concerning the frequency characteristics, the device showed a cutoff frequency of 215 GHz and maximum oscillation frequency of 260 GHz, which provide sufficient performance for W-band MMIC design and fabrication. In addition, active and passive modeling was performed and its accuracy was evaluated by comparing the measured results. The developed mHEMT and device models could be used for the fabrication of W-band MMICs.

In this study, experiments and simulations were conducted for a 1,200-V-class trench Si insulated-gate bipolar transistor (IGBT) with a small cell pitch below 2.5 ㎛. Presently, as a power device, the 1,200-V-class trench Si IGBT is used for automotives including electric vehicles, hybrid electric vehicles, and industrial motors. We obtained a breakdown voltage of 1,440 V, threshold of 6 V, and state voltage drop of 1.75 V. This device is superior to conventional IGBTs featuring a planar gate. To derive its electrical characteristics, we extracted design and process parameters. The cell pitch was 0.95 ㎛ and total wafer thickness was 140 ㎛ with a resistivity of 60 Ω·cm. We will apply these results to achieve fine-pitch gate power devices suitable for electrical automotive industries.

A power device is a component used as a switch or rectifier in power electronics to control high voltages. Consequently, power devices are used to improve the efficiency of electric-vehicle (EV) chargers, new energy generators, welders, and switched-mode power supplies (SMPS). Power device designs, which require high voltage, high efficiency, and high reliability, are typically based on MOSFET (metal-oxide-semiconductor field-effect transistor) and IGBT (insulated-gate bipolar transistor) structures. As a unipolar device, a MOSFET has the advantage of relatively fast switching and low tail current at turn-off compared to IGBT-based devices, which are built on bipolar structures. A superjunction structure adds a p-base region to allow a higher yield voltage due to lower RDS (on) and field dispersion than previous p-base components, significantly reducing the total gate charge. To verify the basic characteristics of the superjunction, we worked with a planar type MOSFET and Synopsys’ process simulation T-CAD tool. A basic structure of the superjunction MOSFET was produced and its changing electrical characteristics, tested under a number of environmental variables, were analyzed.

In this study, we performed the deposition of Al thin film using a DC magnetron sputtering method. To evaluate electrical and structural properties, the growth conditions were changed in terms of two functions, namely, sputtering power ranging from 41.6 to 216 W and film growth rate ranging from 5.35 to 26.39 nm/min. The growth rate and the microstructure were characterized by a scanning electron microscopy and X-ray diffraction analysis. The plane of crystalline growth showed that the preferential (111) direction and defects due to the grain boundary increased with DC power. The resistivity of the Al film over 50 nm showed a constant value by horizontal grain growth. Our results can be applicable for the preparation of nano-templates for anodic aluminum oxide.

Inorganic-organic hybrid perovskite solar cells have demonstrated a significant achievement by reaching a certified power conversion efficiency of 25.2% in 2019 as compared to that of 3.8% in 2009. However, organic hole conductors such as PTAA and spiro-OMeTAD are known to be expensive and unstable when they are exposed to operational conditions. In this study, the inorganic hole conductor CuSCN was used to overcome such concerns. The influence of dipropyl sulfide (DPS) and diethyl sulfide (DES) as CuSCN deposition solvents on the underlying perovskite active layer was investigated. DES solvent was observed to be advantageous in terms of CuSCN solubility and mild for the perovskite layer, thereby resulting in a power conversion efficiency of 16.9%.

We analyzed the drift current by charged particles according to the loading methods applied into a closed cell by electronic ink at a reflective-type display panel using an electrophoretic mechanism. For this experiment, various panels were fabricated with injection voltages for electronic ink taking values in the range -4~0 V. The size of each cell was 220 μm × 220 μm and height of the barrier rib was 54.28 μm. The electronic ink was fabricated by mixing electrically neutral fluid and single-charge white particles. Drift current was measured by moving charged particles. A biasing voltage of 6 V was applied to the display panel. As a result, the drift current was proportional to the injection voltage for electronic ink, but it decreased in case of an injection voltage above -3 V. Our experimentation ascertained that the concentration of charged particles injected into closed cells is controlled by the injection voltage and the selective injection of charged particles above movable q/m is possible.

Metal oxide varistors (MOVs) protect circuits and devices from transient overvoltages in electric power systems. However, a MOV continuously deteriorates owing to manufacturing defects or repetitive protective operations from transient overvoltages. A deteriorated MOV may result in a short circuit or a line-ground accident. Previous studies focused on the analysis of deterioration mechanisms and condition diagnosis techniques for MOVs owing to their recent growth of use. An accelerated deterioration experiment under the same conditions in which a MOV operates is essential. In this study, we designed and fabricated a surge generator that can apply a surge current to a MOV connected to AC mains. The coupling network operates at a low impedance against the surge current from the surge generator and transfers the surge current to the MOV under test. It also acts as a high impedance against AC mains for the AC voltage not to be applied to the surge generator. The decoupling network operates at a high impedance against the surge current and blocks the surge current from AC mains. It also acts as a low impedance against AC mains for the AC voltage to be applied to the MOV under test. The prototype surge generator can apply the 8/20 us up to 15 kA on AC voltages in the approximate range of 110~450 V, and it fully operates on a LabVIEW-based program.

An experimental study was conducted using the tracking wheel test (IEC 62217) method for evaluating the performance of insulator materials, in particular ethylene propylene diene monomer (EPDM) and silicone rubber. In addition, we studied the tracking characteristics resulting from applying the same method for the shape of the insulator housing, that is, the performance of regular and alternating sheds. The evaluation parameters were leakage current, surface characteristics, SEM, EDX, hydrophobicity, and temperature distribution; likewise, we applied the commercial frequency dry (and wet) flashover voltage test. We found that the regular shed had a greater leakage current than the alternating shed and that the recovery of the hydrophobicity in terms of rest time was greater than that of the EPDM in terms of leakage current. All of the regular-shed insulators of silicone rubber had tracking traces and choking on the sheath parting line, while the alternating shed showed only choking at the interface but no tracking traces. Therefore, it can be concluded that the commercial frequency wet flashover voltage of the silicone rubber with regular shed before and after the tracking wheel test is higher than that of the alternating shed.

Thermoelectric Bi2Te3 thin films were synthesized by a co-sputtering method at 300℃. A Fe dopant was considered to enhance the thermoelectric properties of the system. The Seebeck coefficient of the Fe-doped films increased whereas the electrical conductivity decreased. As a result, the power factor of the system increased owing to the enhanced Seebeck coefficient. Grain growth inhibition was detected in the Fe-doped system, which produced more grain boundaries in the Fe-doped films than in the undoped system. The increased grain boundary scattering was deemed to be effective for a reduced thermal conductivity. This is advantageous for the preparation of high-performance thermoelectric films.

Relatively pure YBCO was first synthesized by heating a mixture of metal carbonates at temperatures between 1,000 and 1,300 K, resulting in the reaction: 4BaCO₃＋Y₂(CO₃)₃＋6CuCO₃＋(1/2_-x)O₂ → 2YBa₂Cu₃O_7-x＋1/3CO₂. Modern syntheses of YBCO use the corresponding oxides and nitrates. The superconducting properties of YBa₂Cu₃O_7-x are sensitive to the value of x, i.e., its oxygen content. Only those materials with 0≤x≤0.65 are superconducting below Tc, and when x ~ 0.07, the material superconducts at the highest temperature, i.e., 95 K, or in the highest magnetic fields, i.e., 120 T and 250 T when B is perpendicular and parallel to the CuO₂ planes, respectively. In addition to being sensitive to the stoichiometry of oxygen, the properties of YBCO are influenced by the crystallization methods applied. YBCO is a crystalline material, and the best superconductive properties are obtained when crystal grain boundaries are aligned by careful control of annealing and quenching temperature rates. However, these alternative methods still require careful sintering to produce a quality product. New possibilities have arisen since the discovery of trifluoroacetic acid, a source of fluorine that prevents the formation of undesired barium carbonate (BaCO₃). This route lowers the temperature necessary to obtain the correct phase at around 700℃. This, together with the lack of dependence on vacuum, makes this method a very promising way to achieve a scalable YBCO bulk.

Radiation noise due to EMI noise generated by the driving circuits of LED lighting devices in a medical imaging room was reduced by decreasing the noise source in the driving circuits and changing the number of corrections in EMI filters. Noise attenuation and filter changes enabled driving circuits that reduced the electromagnetic waves. Such circuits were efficiently designed by using capacitors and inverters in a given space. Therefore, the malfunction of radiation devices can be minimized by using EMI-reduction filter circuits, and reliable operation of medical devices can be expected by blocking electromagnetic waves.

Ga₂O₃/n-type 4H-SiC heterojunction diodes were fabricated by RF magnetron sputtering. The optical properties of Ga₂O₃ and electrical properties of diodes were investigated. I-V characteristics were compared with simulation data from the Atlas software. The band gap of Ga₂O₃ was changed from 5.01 eV to 4.88 eV through oxygen annealing. The doping concentration of Ga₂O₃ was extracted from C-V characteristics. The annealed oxygen exhibited twice higher doping concentration. The annealed diodes showed improved turn-on voltage (0.99 V) and lower leakage current (3 pA). Furthermore, the oxygen-annealed diodes exhibited a temperature cross-point when temperature increased, and its ideality factor was lower than that of as-grown diodes.